The hermetic packaging market was valued at USD 3.06 Billion in 2017 and is expected to reach USD 4.52 Billion by 2023, at a CAGR of 6.80% during the forecast period. The base year considered for the study is 2017, and the market size forecast is provided for the period between 2018 and 2023. This report provides the market size and growth potential of the market across different segments such as configuration, type, application, industry, and geography.

The study identifies and analyzes the market dynamics such as drivers, restraints, opportunities, and challenges for the market. It also profiles the key players operating in the market. Factors such as adoption of hermetic packaging for protecting highly sensitive electronic components and growing demand from industries such as automobile electronics and aerospace are expected to propel the growth of the overall market.

The research methodology used to estimate and forecast the hermetic packaging market begins with capturing data on key vendor revenues through secondary research. The secondary sources include annual reports, press releases, and investor presentations of companies; white papers, journals, and certified publications; and articles from recognized authors, websites, directories, and databases such as Hoovers, Bloomberg Businessweek, Factiva, and OneSource.

The vendor offerings have also been taken into consideration to determine the market segmentation. The bottom-up procedure has been employed to arrive at the overall size of the market from the revenue of the key players in the market. After arriving at the overall market size, the total market is split into several segments and subsegments that have been verified through primary research by conducting extensive interviews with key industry experts such as CEOs, VPs, directors, and executives.

Teledyne Microelectronics (US), SCHOTT AG (Germany), AMETEK (US), Amkor Technology (US), Texas Instruments (US), Micross Components (US), Legacy Technologies Inc. (US), KYOCERA Corporation (Japan), Materion Corporation (US), and Willow Technologies (UK) are the hermetic packaging manufacturers offering hermetic packages to end users.