With the shrinking sizes of chips and growing memory content and applications, hybrid memory cube (HMC) and high-bandwidth memory is rapidly replacing the traditional DRAM memory technologies. HMC is a high-performance RAM in terms of bandwidth, power efficiency, and reliability, along with utilizing less energy and storage space as compared to the DRAM memory. Owing to these advantages, the demand and need for HMC and high-bandwidth memory has increased tremendously over the years, thereby pushing the global market towards huge growth.
Driving Factors and Restraints
The global market for hybrid memory cube and high-bandwidth memory is achieving a stellar growth, mainly because of the following factors:
- Growing need for high-bandwidth, low power consumption, and highly scalable memory devices
- Increasing demand for enterprise storage application
- Growing number of data centers and networking devices across the globe
In addition to the aforementioned factors, increasing adoption of cloud-based services and growing applications of big data are expected to further stimulate the market growth. However, declining ASP of traditional DRAM memory may affect the growth of this market. Moreover, there a few manufacturing and fabrication challenges associated with this market.
Market at a Glance
Projected to grow at a CAGR of 53.96% between 2016 and 2022, the worldwide hybrid memory cube and high-bandwidth memory market is expected to be valued at USD 953.8 Million by the end of 2022. Geographically, North America held the largest market share in 2015 due to the presence of almost all the major FPGA and graphic card providers. However, the market in Asia-Pacific is projected to grow at the highest CAGR, owing to the huge demand for consumer electronics and networking devices from countries like China, India, and South Korea.
Based on density, the 8GB density segment is estimated to grow at the highest CAGR over the forecast period, and it is expected to have the higher growth potential in server-based applications. Among applications, the enterprise storage and networking and telecommunication hold the maximum share of the market, as of now. The enterprise storage segment is likely to grow at the highest CAGR between 2016 and 2022.
Ask for Sample Pages @ http://www.marketsandmarkets.com/requestsample.asp?id=150315096
Research Scope
The forecasts and analysis of the global market for hybrid memory cube and high-bandwidth memory has been done by breaking it down into the following segments and sub-segments:
- Density: 2GB, 4GB, 8GB
- Application: Networking & Telecommunication, Enterprise Storage, Industrial, Consumer Electronics (including PCs, Laptops, and Gaming Consoles)
- Region: North America, Europe, Asia-Pacific, RoW
The companies involved in the global market for hybrid memory cube and high-bandwidth memory include Samsung Electronics Co., Ltd. (South Korea), SK Hynix, Inc. (South Korea), Micron Technology, Inc. (U.S.), Intel Corporation (U.S.), Fujitsu Ltd. (Japan), IBM (U.S.), Xilinx Inc. (U.S.), Advanced Micro Devices, Inc. (U.S.), Nvidia Corporation (U.S.), Open-Silicon, Inc. (U.S.) and Arira (U.S.).
